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    Modelado de componentes pasivos de montaje superficial en radiofrecuencia

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    Modelado de componen ... (845.2Kb)
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    URI: http://hdl.handle.net/10902/2798
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    Author
    Cagigas Ibáñez, Jaime; Artal Latorre, EduardoAutoridad Unican
    Date
    2009-09
    Derechos
    © 2009 URSI España
    Publicado en
    URSI 2009, XXIV Simposium Nacional de la Unión Científica Internacional de Radio, Santander
    Abstract:
    In this paper, lumped-element models for surface mounted devices (SMD), capacitors and inductors, are presented. The parasitic and packaging effects of SMD are extracted, including the characterization of the interconnects. The equivalent circuit parameters are extracted from Sparameters tests. These models are suitable for microstrip mounted components, and in the frequencies range 100 MHz to 4 GHz. The modelling and extraction procedure is demonstrated for 0805 style components.
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    • D12 Congresos [539]

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    UNIVERSIDAD DE CANTABRIA

    Repositorio realizado por la Biblioteca Universitaria utilizando DSpace software
    Contact Us | Send Feedback
    Metadatos sujetos a:licencia de Creative Commons Reconocimiento 3.0 España