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Departamento de Ingeniería de Comunicaciones (DICOM): Envíos recientes
Mostrando ítems 141-160 de 1066
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Bimodal microwave and ultrasound phantoms for non-invasive clinical imaging
(Nature Publishing Group, 2020-11-23) -
Segmentation approaches for diabetic foot disorders
(MDPI, 2021-01-26) -
NOMA-based improper signaling for multicell MISO RIS-assisted broadcast channels
(Institute of Electrical and Electronics Engineers, Inc., 2023-03-20) -
On the existence of shear-current effects in magnetized burgulence
(Institute of Physics Publishing, 2020-12-28) -
Local eigenvalue decomposition for embedded Riemannian manifolds
(Elsevier Inc., 2020-11-01) -
Manifold curvature learning from hypersurface integral invariants
(Elsevier Inc., 2020-10-01) -
Rate splitting in MIMO RIS-assisted systems with hardware impairments and improper signaling
(Institute of Electrical and Electronics Engineers, Inc., 2023-04) -
Finite buffer queuing delay performance in the low earth orbit land mobile satellite channel
(Institute of Electrical and Electronics Engineers, Inc., 2022) -
Analysis of extrinsic chirality in layer by layer structures distributed in non-planar unit-cell arrangements at microwave frequencies
(Institute of Electrical and Electronics Engineers, Inc., 2022) -
In-Lab calibration of single TE21 monopulse tracking systems
(Institute of Electrical and Electronics Engineers, Inc., 2022) -
Overcoming the barriers of using linked open data in smart city applications
(Institute of Electrical and Electronics Engineers, Inc., 2022-12) -
On the use of Blockchain to enable a highly scalable Internet of Things Data Marketplace
(Elsevier, 2023-07) -
Nonlinear analysis of oscillators based on a slow-wave structure for phase-noise reduction
(Institute of Electrical and Electronics Engineers, Inc., 2022) -
Oscillators based on step-impedance and slow wave transmission lines for sensing applications
(Institute of Electrical and Electronics Engineers Inc., 2023-01) -
Linear dual-polarized microstrip patch antenna with U-shaped aperture
(Institute of Electrical and Electronics Engineers, Inc., 2022)