Structural parameters and behavior in simulated body fluid of high entropy alloy thin films
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Craciun, Doina; Laszlo, Edwin Alexandru
Fecha
2024-03-01Derechos
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Publicado en
Materials, 2024, 17(5), 1162
Editorial
MDPI
Palabras clave
High-entropy alloy (HEA)
High-entropy nitride alloy (HEN)
Thin films
Pulsed laser deposition
Electrochemical and corrosion behavior
OCP
EIS
Ringer solution
Chemical and physical barrier
Resumen/Abstract
The structure, composition and corrosion properties of thin films synthesized using the
Pulsed Laser Deposition (PLD) technique starting from a three high entropy alloy (HEA) AlCoCrFeNix
produced by vacuum arc remelting (VAR) method were investigated. The depositions were performed
at room temperature on Si and mirror-like polished Ti substrates either under residual vacuum
(low 10-7 mbar, films denoted HEA2, HEA6, and HEA10, which were grown from targets with Ni
concentration molar ratio, x, equal to 0.4, 1.2, and 2.0, respectively) or under N2
(10-4 mbar, films denoted HEN2, HEN6, and HEN10 for the same Ni concentration molar ratios). The deposited films'structures, investigated using Grazing Incidence X-ray Diffraction, showed the presence of
face-centered cubic and body-centered cubic phases, while their surface morphology, investigated
using scanning electron microscopy, exhibited a smooth surface with micrometer size droplets. The
mass density and thickness were obtained from simulations of acquired X-ray reflectivity curves.
The films' elemental composition, estimated using the energy dispersion X-ray spectroscopy, was
quite close to that of the targets used. X-ray Photoelectron Spectroscopy investigation showed that
films deposited under a N2 atmosphere contained several percentages of N atoms in metallic nitride
compounds. The electrochemical behavior of films under simulated body fluid (SBF) conditions
was investigated by Open Circuit Potential (OCP) and Electrochemical Impedance Spectroscopy
measurements. The measured OCP values increased over time, implying that a passive layer was
formed on the surface of the films. It was observed that all films started to passivate in SBF solution,
with the HEN6 film exhibiting the highest increase. The highest repassivation potential was exhibited
by the same film, implying that it had the highest stability range of all analyzed films. Impedance
measurements indicated high corrosion resistance values for HEA2, HEA6, and HEN6 samples.
Much lower resistances were found for HEN10 and HEN2. Overall, HEN6 films exhibited the best
corrosion behavior among the investigated films. It was noticed that for 24 h of immersion in SBF
solution, this film was also a physical barrier to the corrosion process, not only a chemical one.
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