Método de extracción de modelos circuitales de dispositivos encapsulados de microondas

Abstract

This work is the result of the investigations in the modelling of microwave packaged devices made by our group. A robust and accurate-straightforward electrical small signal modelling technique for radiofrequency and microwave packaged devices, is shown. This method called DICOMPAK is based on previous works made by us, and can be used for the electrical modelling of two types of packaged devices: ceramic packaged devices and low cost plastic encapsulated devices. The technique employs analytically derived expressions and it is based on analysis of the measured scattering parameters over an adequate frequency range. Very good agreement is shown between measured and simulated scattering parameters for different ceramic and plastic packaged devices from several foundries.