Caracterización de transiciones coplanar-Microstrip en banda W

Abstract

Characterization and modelling of devices, in particular diodes, in W band becomes a complex task due to the difficulties to de-embed parasitic effects of the access elements. We present a CAD model developed for two CPW-Microstrip transitions connected with a bond wire. It will be used to deembed device measurements from empirical data results when using a commercial calibration substrate with measurement reference planes at the probe tips, which not includes CPW to microstrip transitions in the standards neither wire bonds. The Interface Model has been verified by comparing measurements and two types of simulations (3D EM and circuital physicallybased) of the CPW_Micorstrip- bond_wire-CPW_Microstrip.