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dc.contributor.authorCagigas Ibañez, Jaime 
dc.contributor.authorArtal Latorre, Eduardo 
dc.contributor.otherUniversidad de Cantabriaes_ES
dc.date.accessioned2013-07-30T12:52:31Z
dc.date.available2013-07-30T12:52:31Z
dc.date.issued2009-09
dc.identifier.urihttp://hdl.handle.net/10902/2798
dc.description.abstractIn this paper, lumped-element models for surface mounted devices (SMD), capacitors and inductors, are presented. The parasitic and packaging effects of SMD are extracted, including the characterization of the interconnects. The equivalent circuit parameters are extracted from Sparameters tests. These models are suitable for microstrip mounted components, and in the frequencies range 100 MHz to 4 GHz. The modelling and extraction procedure is demonstrated for 0805 style components.es_ES
dc.format.extent4 p.es_ES
dc.language.isospaes_ES
dc.rights© 2009 URSI Españaes_ES
dc.sourceURSI 2009, XXIV Simposium Nacional de la Unión Científica Internacional de Radio, Santanderes_ES
dc.titleModelado de componentes pasivos de montaje superficial en radiofrecuenciaes_ES
dc.typeinfo:eu-repo/semantics/conferenceObjectes_ES
dc.rights.accessRightsopenAccesses_ES
dc.type.versionpublishedVersiones_ES


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