Modelado de componentes pasivos de montaje superficial en radiofrecuencia

Abstract

In this paper, lumped-element models for surface mounted devices (SMD), capacitors and inductors, are presented. The parasitic and packaging effects of SMD are extracted, including the characterization of the interconnects. The equivalent circuit parameters are extracted from Sparameters tests. These models are suitable for microstrip mounted components, and in the frequencies range 100 MHz to 4 GHz. The modelling and extraction procedure is demonstrated for 0805 style components.