@conference{10902/3339,
year = {2006},
month = {9},
url = {http://hdl.handle.net/10902/3339},
abstract = {This work is the result of the investigations in the
 modelling of microwave packaged devices made by our group.
 A robust and accurate-straightforward electrical small signal
 modelling technique for radiofrequency and microwave
 packaged devices, is shown. This method called DICOMPAK is
 based on previous works made by us, and can be used for
 the electrical modelling of two types of packaged devices:
 ceramic packaged devices and low cost plastic encapsulated
 devices. The technique employs analytically derived expressions
 and it is based on analysis of the measured scattering
 parameters over an adequate frequency range. Very good
 agreement is shown between measured and simulated scattering
 parameters for different ceramic and plastic packaged devices
 from several foundries.},
publisher = {URSI 2006, XXI Simposium Nacional de la Unión Científica Internacional de Radio, Oviedo, p. 1648-1651},
title = {Método de extracción de modelos circuitales de dispositivos encapsulados de microondas},
author = {Zamanillo Sainz de la Maza, José María and Pérez Vega, Constantino and Mediavilla Sánchez, Ángel},
}